McDarmid Adhesives for Power Electronics
We offer a variety of new joining materials suitable for chip bonding, including heat-resistant fatigue solder and EV materials.
MacDermid Performance Solutions has finally begun to seriously address the lead-free transition of high melting point solders, which had previously been excluded due to the lack of suitable solder materials. At the same time, there is a demand for bonding materials that can fully leverage the capabilities of next-generation power semiconductors. Alpha Argomax sinter paste is a bonding material that can meet both of these challenging requirements. Alpha Assembly Solutions is also focusing on the development of high thermal conductivity epoxy pastes.
